Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etchi...
محفوظ في:
المؤلفون الرئيسيون: | Narongchai Siwarakrangsun, Nithi Atthi, Supanit Porntheeraphat, Jirawat Jantawong, Komgrit Leksakul, Amporn Poyai |
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التنسيق: | Book Series |
منشور في: |
2018
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الموضوعات: | |
الوصول للمادة أونلاين: | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570 |
الوسوم: |
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مواد مشابهة
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Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
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