Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection

• Main Authors: Hu, Xiao, Yang, Ying, Chen, Zhong, Chan, Yan Cheong, Xu, Sha
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: https://hdl.handle.net/10356/102893; http://hdl.handle.net/10220/24293
• Institution: Nanyang Technological University

Electroless Ni–P under bump metallization (UBM) has advantages of even surface, low cost and simplicity to deposit, but their mechanical strength, corrosion resistance and stability still face challenges under high soldering temperature. Incorporating carbon nanotubes (CNTs) into electroless Ni–P UB...