TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal

TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal

3D integration has been widely recognized as the next generation of technology for integrated microsystems with small form factor, high bandwidth, low power consumption, and possibility of heterogeneous More-than-Moore integration. Heterogeneous integration of MEMS and CMOS is critical in future dev...

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書目詳細資料
Main Authors:	Tan, Chuan Seng, Razzaq, A., Wee, K. H., Li, K. H., Yu, H., Chua, S. L.
其他作者:	School of Electrical and Electronic Engineering
格式:	Conference or Workshop Item
語言:	English
出版:	2014
主題:	DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
在線閱讀:	https://hdl.handle.net/10356/103614 http://hdl.handle.net/10220/24544
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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