Thermal stress analysis of electronic packaging components

Thermal stress analysis of electronic packaging components

The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints o...

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書目詳細資料
主要作者:	See Toh, Chee Wai.
其他作者:	Pang, John Hock Lye
格式:	Theses and Dissertations
語言:	English
出版:	2008
主題:	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
在線閱讀:	http://hdl.handle.net/10356/13448
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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