Ultra-thin bulk silicon thinning of advanced microprocessors & graphics processors fabricated in Sub-20 nm technology

The continual advancement of integrated circuits has seen the relentless scaling of minimum dimensions for semiconductor devices. Consequently, the burgeoning complexity of process technology and devices fabricated has necessitated advancements in device characterisation all through the failure anal...

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Bibliographic Details
Main Author: Teo, Wee Siang
Other Authors: Gan Chee Lip
Format: Thesis-Master by Research
Language:English
Published: Nanyang Technological University 2020
Subjects:
Online Access:https://hdl.handle.net/10356/144132
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Institution: Nanyang Technological University
Language: English

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