Investigation of low temperature wafer bonding using intermediate layer

Investigation of low temperature wafer bonding using intermediate layer

In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).

Saved in:

書目詳細資料
主要作者:	Deng, Shusheng
其他作者:	Tan, Cher Ming
格式:	Theses and Dissertations
出版:	2008
主題:	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
在線閱讀:	http://hdl.handle.net/10356/4209
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Study of low temperature plasma activated wafer bonding
由: Yeo, Thomas Peng Siong.
出版: (2013)

Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
由: Yu, Weibo
出版: (2008)

Study of Ag-In solder as low temperature wafer bonding intermediate layer
由: Made, R.I., et al.
出版: (2014)

Improvement on within wafer and wafer-to-wafer uniformity by chemical mechanical polishing (CMP)
由: Wu, Hong Ying.
出版: (2008)

Low temperature three dimensional wafer level copper thermo-compression bonding
由: Lim, Dau Fatt.
出版: (2013)

Mathematical model of low-temperature wafer bonding under medium vacuum and its application
由: Yu, Weibo, et al.
出版: (2009)

Void density investigation of low temperature InP (chip) /Al2O3/Si (wafer) direct bonding
由: Shang, Ling Ru
出版: (2015)

Automated wafer management system
由: Lim, Kai Yi
出版: (2015)

Wafer fabrication cycle time report
由: Cheng, Hao Fen.
出版: (2013)

Low temperature InP (chip) / Al2O3 / Si (wafer) direct bonding
由: Lin, Yiding
出版: (2015)

Characteristics of chemical mechanical polishing in advanced wafer processing
由: Huang, Wen Ke.
出版: (2008)

Wafer-scale deposition of transition metal Dichalcogenide film
由: Ang, Nicole Ru Xuan
出版: (2022)

High-κ Al2O3 material in low temperature wafer-level bonding for 3D integration application
由: Tan, Chuan Seng, et al.
出版: (2014)

Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability
由: Peng, L., et al.
出版: (2013)

Interface characterization of wafer bonding
由: Sun, Lina
出版: (2011)

Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
由: Lee, C., et al.
出版: (2014)

Significance of process exhaust system on wafer fab operation and its performance improvement
由: Vedachalam Natanasabapathy
出版: (2008)

Characterization and investigation of low-frequency noise in emerging CMOS
由: Wei, Chengqing
出版: (2011)

Pure sulfide kesterite solar cells with cation substituted absorber and back contact intermediate layer
由: Zhuk, Siarhei
出版: (2020)

Realization of trenched SOI structure using wafer bonding technique
由: Teo, Kim Poh.
出版: (2008)

Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding
由: Tan, Cher Ming, et al.
出版: (2013)

Monolithic integration of GAAS-to-SI by direct wafer bonding
由: Yeo, Chiew Yong
出版: (2014)

Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds
由: Tan, Chuan Seng, et al.
出版: (2013)

Low temperature thermocompression bonding of copper-copper bumps using gold alloy nanoparticles
由: Tan, Shi Liang.
出版: (2012)

Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking
由: Peng, L., et al.
出版: (2013)

Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging
由: Lee, C., et al.
出版: (2014)

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
由: Lau, John H., et al.
出版: (2011)

Graphene field effect transistor photodetector fabrication and investigation
由: Deng, Qinfei
出版: (2012)

Electrical characterization of GaN-based layer structures
由: Firdous Banu
出版: (2011)

Design and fabrication of insulated gate bipolar transistor (IGBT) using wafer bonding technology
由: Tan, Cher Ming., et al.
出版: (2008)

Development of wafer bonding technology for micro-electro-mechanical systems application
由: Wang, Lei.
出版: (2008)

A feasibility study on the manufacture of silicon wafers
由: Francisco, Ramon, et al.
出版: (1981)

Growth and characterization of metamorphic layer structures for high electron mobility transistors
由: Yuan, Kaihua.
出版: (2008)

Temperature dependence of DC and RF characteristics in RF MOSFETs
由: Jiang, Shangbin
出版: (2011)

Bias temperature instability of nano-scale silicon transistors
由: Ho, Terence Jun Jie
出版: (2014)

GeSn-on-insulator substrate formed by direct wafer bonding
由: Lee, Kwang Hong, et al.
出版: (2016)

Characterization and modeling of negative bias temperature instability in P-MOSFETs
由: Yang, Jianbo
出版: (2010)

Study on the semiconductor wafer fabrication performance improvement based on job release control
由: Andy Darwin Kasan Hidayat
出版: (2008)

Geometry and thermal stress analysis of in-plane outgassing channels in Al2O3-intermediated InP (die)-to-Si (wafer) bonding
由: Lin, Yiding, et al.
出版: (2019)

Low power adiabatic CMOS circuits
由: Ng, Kim Wee.
出版: (2008)