DEVELOPMENT OF PLASMA ETCHING AND STRIPPING PROCESSES OF LOW-K DIELECTRICS FOR COPPER DAMASCENE METALLISATION
Master's
Saved in:
Main Author: | CHUA MAY LEE PAULINE |
---|---|
Other Authors: | SINGAPORE-MIT ALLIANCE |
Format: | Theses and Dissertations |
Published: |
2019
|
Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/153904 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
A dual BARC method for lithography and etch for Dual damascene with low K
by: Mukherjee-Roy, M., et al.
Published: (2014) -
STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
by: WONG KAH LEONG
Published: (2019) -
Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects
by: Ngwan, V.C., et al.
Published: (2014) -
Plasma etching optimization of oxide/nitride/oxide interpoly dielectric breakdown time in flash memory devices
by: Cha, C.L., et al.
Published: (2014) -
Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
by: MUKHERJEE-ROY MOITREYEE
Published: (2010)