New mechanism of leakage current in ultra-shallow junctions with TiSi2 contacts
Proceedings of the International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA
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Main Authors: | Lau, Wai Shing, Qian, Peng Wei, Zhao, Rong |
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Other Authors: | ELECTRICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/81589 |
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Institution: | National University of Singapore |
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