Novel nickel silicide contact technology using selenium segregation for SOI N-FETs with silicon-carbon source/drain stressors
10.1109/LED.2008.2000716
Saved in:
Main Authors: | Wong, H.-S., Liu, F.-Y., Ang, K.-W., Samudra, G., Yeo, Y.-C. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/82786 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Ni(Ge1-xSnx) ohmic contact formation on N-Type Ge1-xSnx using selenium or sulfur implant and segregation
by: Tong, Y., et al.
Published: (2014) -
Selenium segregation for lowering the contact resistance in ultrathin-body MOSFETs with fully metallized source/drain
by: Wong, H.-S., et al.
Published: (2014) -
Selenium segregation for effective schottky barrier height reduction in NiGe/n-Ge contacts
by: Tong, Y., et al.
Published: (2014) -
Effective Schottky Barrier height reduction using sulfur or selenium at the NiSi/n-Si (100) interface for low resistance contacts
by: Wong, H.-S., et al.
Published: (2014) -
Drivability improvement in Schottky barrier source/drain MOSFETs with strained-Si channel by Schottky barrier height reduction
by: Zhu, S., et al.
Published: (2014)