Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via

• Main Author: Lin, Ye
• Other Authors: Tan Chuan Seng
• Format: Theses and Dissertations
• Language: English
• Published: 2019
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: https://hdl.handle.net/10356/102666; http://hdl.handle.net/10220/48586
• Institution: Nanyang Technological University

In this thesis, a novel integrated capacitor, called “three-dimensional (3-D) embedded capacitor” is proposed, designed, fabricated, and characterized for application in integrated circuits (ICs) with through-silicon vias (TSVs). A significant capacitance density enhancement can be achieved for this...