Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

• المؤلفون الرئيسيون: Yang, Ying, Huang, Yizhong, Liu, Hai, Chen, Zhong, Balaraju, J. N.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Materials::Electronic packaging materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/104531; http://hdl.handle.net/10220/20248
• المؤسسة: Nanyang Technological University

To address the reliability challenges brought by the accelerated reaction with the implementation of lead-free solders, an electrolessly plated Ni-Co-P alloy (3~4 wt.% P and 9~12 wt.% Co) was developed as the solder metallization in this study. Three compounds layers, (Ni,Co)3Sn4, (Ni,Co)3P and (Ni,...