Fabrication of tin dioxide on silicon doxide substrate using Filtered Cathodic Vacuum Arc (FCVA) technique
Tin dioxide has been reported to be a direct band gap semiconductor with broad applications. Transparent polycrystalline tin dioxide (SnO2) film grown using FCVA technique has an energy band gap of 3.59eV, uniform thickness, high mechanical strength and outstanding transparency. These unique prope...
Saved in:
Main Author: | Ji, Yun |
---|---|
Other Authors: | Yu Siu Fung |
Format: | Final Year Project |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/17267 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Filtered cathodic vacuum arc deposition of metal nitrides
by: Ji, Xiaohong
Published: (2009) -
Modeling and characterization of double bend filtered cathodic vacuum arc system
by: You, Guo Feng
Published: (2008) -
Study of filtered cathodic vacuum arc technology and properties of tetrahedral amorphous carbon films
by: Tay, Beng Kang
Published: (2008) -
Design and fabrication of an improved filtered cathodic vacuum ARC (FCVA) deposition system for tetrahedral amorphous carbon (TA-C) films
by: Tay, Beng Kang
Published: (2008) -
Mechanical and tribological study of DLC coatings deposited by filtered cathodic vacuum arc
by: Choo, Chee Wee.
Published: (2011)