Investigation on bond strength and contact resistance of copper-copper bonds for 3D integrated circuits

• Main Author: Ong, Sharon Zi Xuan.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: http://hdl.handle.net/10356/38612
• Institution: Nanyang Technological University

Advancement of the current Two-Dimensional integrated circuits (2D-ICs) is limited by increasing interconnect delay and huge power dissipation problem. Hence, Three-Dimensional integrated circuits (3D-ICs) technology, in which active layers are stacked vertically and linked by short vertical interla...