Development of magnetic current imaging for the failure analysis of 3D package technology

Development of magnetic current imaging for the failure analysis of 3D package technology

“More than Moore” trend has triggered the development of three-dimensional (3D) technologies which are important in terms of their reliability and performance. However, the introduction of these new technologies presents new challenges in fault isolation and failure analysis of short circuits, open...

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書目詳細資料
主要作者:	Kor, Katherine Hwee Boon.
其他作者:	Gan Chee Lip
格式:	Theses and Dissertations
語言:	English
出版:	2013
主題:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials DRNTU::Engineering::Materials::Electronic packaging materials
在線閱讀:	http://hdl.handle.net/10356/51193
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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