Process induced reliability of through silicon via
Insatiable consumer demand for multifunctional and high performance integrated circuits and systems has necessitated three-dimensional (3D) integration with through silicon via (TSV) technology. 3D integration has provided a scaling path to reduce the wire length and power consumption. At the same t...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2014
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| Online Access: | https://hdl.handle.net/10356/61812 |
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| Institution: | Nanyang Technological University |
| Language: | English |