Study of Cu diffusion in Cu/Tan/SiO2/Si multilayer structures
10.1016/S0218-625X(01)00127-0
Saved in:
Main Authors: | Zhang, D.H., Loh, S.W., Li, C.Y., Foo, P.D., Xie, J., Liu, R., Wee, A.T.S., Zhang, L., Lee, Y.K. |
---|---|
Other Authors: | INSTITUTE OF ENGINEERING SCIENCE |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/113105 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Study on SiNx passivated Cu/Ta/SiO2/Si multilayer structure
by: Latt, K.M., et al.
Published: (2014) -
The impact of layer thickness of IMP-deposited tantalum nitride films on integrity of Cu/TaN/SiO2/Si multilayer structure
by: Latt, K.M., et al.
Published: (2014) -
Thermal stability of Cu/α-Ta/SiO2/Si structures
by: Yuan, Z.L., et al.
Published: (2014) -
Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
by: Latt, K.M., et al.
Published: (2014) -
Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration
by: Yang, L.Y., et al.
Published: (2014)