Electromigration study of through silicon via (TSV)

Electromigration study of through silicon via (TSV)

In the continuous drive for smaller chips (Moore’s Law) and heterogeneous semiconductor applications, traditional processing and packaging technologies may not be able to support this trend. 3-D IC can offer a greater packing density in the same footprint as 2-D miniaturizing is reaching its physic...

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書目詳細資料
主要作者:	Tan, Yeow Chong
其他作者:	Tan Cher Ming
格式:	Theses and Dissertations
語言:	English
出版:	2011
主題:	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
在線閱讀:	https://hdl.handle.net/10356/43544
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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