Feasibility study of using thin aluminum nitride film as a buffer layer for dual metal gate process
10.1016/j.tsf.2004.05.083
Saved in:
Main Authors: | Park, C.S., Cho, B.J., Balasubramanian, N., Kwong, D.-L. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/56032 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
An integratable dual metal gate CMOS process using an ultrathin aluminum nitride buffer layer
by: Park, C.S., et al.
Published: (2014) -
Three-layer laminated metal gate electrodes with tunable work functions for CMOS applications
by: Bai, W.P., et al.
Published: (2014) -
Thermally stable fully silicided Hf-silicide metal-gate electrode
by: Park, C.S., et al.
Published: (2014) -
Advanced gate stack for CMOS nanotechnology
by: LIM EU-JIN ANDY
Published: (2010) -
Work function tuning and material characteristics of lanthanide-incorporated metal nitride gate electrodes for NMOS device applications
by: Ren, C., et al.
Published: (2014)