Spatially-programmable thermal processing module for 300 mm wafer processing
10.1117/12.425238
Saved in:
Main Authors: | Tay, A., Khiang Wee Lim, Ai Poh Loh, Woei Wan Tan, Weng Khuen Ho, Huang, A., Fu, J. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/71836 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Integrated bake/chill module with in situ temperature measurement for photoresist processing
by: Tay, A., et al.
Published: (2014) -
Influence of wafer warpage on photoresist film thickness and extinction coefficient measurements
by: Wu, X., et al.
Published: (2014) -
Real-time control of photoresist extinction coefficient uniformity in the microlithography process
by: Tay, A., et al.
Published: (2014) -
Real-time spatial control of steady-state wafer temperature during thermal processing in microlithography
by: Tay, A., et al.
Published: (2014) -
In situ monitoring of photoresist thickness uniformity of a rotating wafer in lithography
by: Tay, A., et al.
Published: (2014)