Thermal stability of Cu/α-Ta/SiO2/Si structures

• Main Authors: Yuan, Z.L., Zhang, D.H., Li, C.Y., Prasad, K., Tan, C.M.
• Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
• Format: Article
• Published: 2014
• Subjects: α-Ta; Cu metallization; Diffusion barrier; SiO2; Thermal stability
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/90377
• Institution: National University of Singapore

10.1016/j.tsf.2004.05.057