Application of supercritical CO2 for wafer processing steps

Application of supercritical CO2 for wafer processing steps

Invention disclosures have been submitted to NTU for consideration. 1. Method of Forming Palladium Seeding nanoparticles and Film on Barrier Layer for Copper Metallization in Semiconductor Wafer Manufacturing Abstract A method for the deposition of noble metal nanoparticles or thin film such as t...

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書目詳細資料
Main Authors:	Tse, Man Siu., Tay, Joo Hwa., Wong, Fook Sin.
其他作者:	School of Electrical and Electronic Engineering
格式:	Research Report
語言:	English
出版:	2008
主題:	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
在線閱讀:	http://hdl.handle.net/10356/14252
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Nanyang Technological University
語言:	English

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