Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV)
In this work, a new design of 3-D MIM capacitor embedded in partially-filled TSV is proposed and evaluated. The electrical characteristics of 3-D MIM capacitors confirm that the new design effectively mitigates the process-induced thermo-mechanical stress between TSV Cu core and the surrounding str...
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Main Authors: | Lin, Ye, Li, Hong Yu, Tan, Chuan Seng |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Conference or Workshop Item |
Language: | English |
Published: |
2020
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/144088 |
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Institution: | Nanyang Technological University |
Language: | English |
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