Reliability characterization of organic ultra low k film using ramp voltage breakdown
Proceedings - Electrochemical Society
Saved in:
Main Authors: | Krishnamoorthy, A., Murthy, B.R., Yiang, K.Y., Yoo, W.J. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/71606 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Investigation of electrical conduction in carbon-doped silicon oxide using a voltage ramp method
by: Yiang, K.Y., et al.
Published: (2014) -
Effect of porosity on electrical stability of hydrocarbon polymeric low-k dielectric
by: Yiang, K.Y., et al.
Published: (2014) -
Reliability improvement to copper damascene structures using buried capping layer
by: Yiang, K.Y., et al.
Published: (2014) -
Dielectric reliability of copper/low-k interconnects
by: YIANG KOK YONG
Published: (2010) -
RELIABLE METHOD FOR ACCURATE MEASUREMENTS OF THE BREAKDOWN VOLTAGE IN MICRO-GAPS
by: Eka Purba Sejati, Aditya