Test bench modeling and characterization for fine pitch wafer level packaged devices

Test bench modeling and characterization for fine pitch wafer level packaged devices

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Jayabalan, J., Mihai, R.D., Tan, J.P.H., Iyer, M.K., Leong, O.B., Seng, L.M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Fine pitch
Interconnect modeling
Multi-gigahertz test
Wafer level package
Online Access:http://scholarbank.nus.edu.sg/handle/10635/71958
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Institution: National University of Singapore

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