Application of supercritical CO2 for wafer processing steps

• المؤلفون الرئيسيون: Tse, Man Siu., Tay, Joo Hwa., Wong, Fook Sin.
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: Research Report
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/14252
• المؤسسة: Nanyang Technological University

Invention disclosures have been submitted to NTU for consideration. 1. Method of Forming Palladium Seeding nanoparticles and Film on Barrier Layer for Copper Metallization in Semiconductor Wafer Manufacturing Abstract A method for the deposition of noble metal nanoparticles or thin film such as t...