Integrated bake/chill module with in situ temperature measurement for photoresist processing

Integrated bake/chill module with in situ temperature measurement for photoresist processing

10.1109/TSM.2004.826959

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Bibliographic Details
Main Authors: Tay, A., Ho, W.-K., Loh, A.-P., Lim, K.-W., Tan, W.-W., Schaper, C.D.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
300-mm wafer processing
In situ temperature measurement
Lithography
Photoresist processing
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70617
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Institution: National University of Singapore

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