Effect of substrate bias on Ta-Ni diffusion barrier film for copper metallization

• Main Author: Yantara, Natalia
• Other Authors: Chen Zhong
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/15630
• Institution: Nanyang Technological University

The effects of substrate bias on the properties of Ta-Ni film as a diffusion barrier for copper metallization were investigated. Ta-Ni films with Ta:Ni ratio 2.32-2.75 were deposited on the p-type silicon (100) wafers using magnetron co-sputtering with various substrate bias ranging from 0 - 100 wa...