Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

10.1016/S0921-5107(02)00093-4

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書目詳細資料
Main Authors:	Latt, K.M., Lee, Y.K., Osipowicz, T., Park, H.S.
其他作者:	PHYSICS
格式:	Article
出版:	2014
主題:	Diffusion barrier Interfacial reaction Metallization Phase transformation Tantalum (Ta)
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/96965
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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