Particle reduction of novellus PEP3510 photo resist stripper
The objective of this project is to resolve defect density issues of the Novellus Photo Resist Strip to reduce wafer scrape and improve yield for Chartered Silicon Partners, Fab 6, CHRT. The engineers will be able to use the resolution of the findings and implement across all Novellus Photo Resist S...
Saved in:
Main Author: | Chai, Koh Chin |
---|---|
Other Authors: | Ahn Jaeshin |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/4979 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Study of copper contamination and copper induced particles for 2nd generation 300mm wafer fab
by: Chan, Jin Seng.
Published: (2008) -
Optimisation of the ultrafast high sintering process for NanoCu particles bonding
by: Koh, Clifford Sin Yuen
Published: (2022) -
Demonstration lithography using plasma focus soft x-ray source
by: Lee, Sing, et al.
Published: (2008) -
Chemical and mechanical polishing for realization of advanced planarization schemes and patterned SOI structures
by: Goh, Wang Ling., et al.
Published: (2008) -
Investigation of ultra high-speed heterojunction bipolar transistors fabricated in molecular beam epitaxy technology
by: Yoon, Soon Fatt.
Published: (2008)