Processing and characterization of low-k materials for ULSI application
In this project, chemical vapor deposited carbon doped oxide films, with dielectric constants in the range of 2.7 to 3.5 were studied.
Saved in:
Main Author: | Widodo, Johnny. |
---|---|
Other Authors: | Mhaisalkar, Subodh Gautam |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/5060 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Chemical mechanical polishing process of copper metallization in the ULSI devices
by: Leow, Nelson Whatt Wei.
Published: (2008) -
Study on copper electromigration reliability of the ULSI devices
by: Low, Joon Kiat.
Published: (2008) -
Electromigration behaviour of copper metal lines in ULSI devices
by: Ong, Sock Meng.
Published: (2008) -
Investigation on the formation of C54-TiSi2 used as contact metallization in ULSI application
by: Zhang, Lin
Published: (2008) -
Development and integration of new ultra low k materials & processes for high reliability microelectronics
by: Mhaisalkar, Subodh Gautam.
Published: (2008)