Effectiveness of reservoir length on electromigration lifetime enhancement for ULSI interconnects with advanced technology nodes
Reservoir length in ULSI interconnections can enhance their electromigration lifetime. As low-K dielectric is employed in current technology node, and line current density and temperature increase as we advanced in technology node, we investigate the impact of the above-mentioned on the effectivenes...
محفوظ في:
المؤلفون الرئيسيون: | Tan, Cher Ming, Fu, Chunmiao |
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مؤلفون آخرون: | School of Electrical and Electronic Engineering |
التنسيق: | Conference or Workshop Item |
اللغة: | English |
منشور في: |
2013
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الموضوعات: | |
الوصول للمادة أونلاين: | https://hdl.handle.net/10356/101087 http://hdl.handle.net/10220/16310 |
الوسوم: |
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المؤسسة: | Nanyang Technological University |
اللغة: | English |
مواد مشابهة
-
Study on the effectiveness of reservoir length in improving electromigration in Cu/Low-k interconnects
بواسطة: Fu, Chunmiao
منشور في: (2011) -
Realistic modeling of electromigration in today’s ULSI interconnections
بواسطة: Li, Wei
منشور في: (2009) -
Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects
بواسطة: Shao, W., وآخرون
منشور في: (2012) -
Studies of wafer level electromigration test for ULSI
بواسطة: Sum, Heng Keong.
منشور في: (2008) -
Study on copper electromigration reliability of the ULSI devices
بواسطة: Low, Joon Kiat.
منشور في: (2008)